HONOR Magic 7 series specs leak: Snapdragon 8 Elite, periscope telephoto lens, ultrasonic fingerprint sensors, 3D face unlock

HONOR is set to unveil its highly anticipated Magic 7 series on October 30th. Powered by Qualcomm’s latest Snapdragon 8 Elite chipset, these devices promise to be among the most powerful smartphones of the year.

Key Features and Specifications of the HONOR Magic 7 series:

HONOR Magic 7 specs leak.
  • Snapdragon 8 Elite Chipset: The Magic 7 series will be the first to feature Qualcomm’s cutting-edge Snapdragon 8 Elite chipset, offering significant improvements in CPU, GPU, and AI performance.
  • Dual Camera Setup: Both the Magic 7 and Magic 7 Pro will feature advanced camera systems. The Pro model will likely boast a periscope telephoto lens for superior zoom capabilities, while the standard version will have an optical telephoto lens.
  • Biometric Security: Both devices will feature ultrasonic fingerprint sensors, a more secure alternative to optical sensors. Additionally, the Magic 7 Pro is expected to support 3D face unlock, similar to Apple’s Face ID.
  • Fast Charging: Both models will support 100W wired charging, ensuring quick and convenient battery replenishment.
  • Display: The Magic 7 Pro is rumored to feature a 2K OLED display with a high refresh rate, while the standard Magic 7 may have a 1.5K display.
  • Satellite Communication: The Magic 7 Pro could potentially include satellite communication capabilities, a unique feature that sets it apart from competitors.

A Flagship to Watch:

HONOR Magic 7 series render.

With its powerful Snapdragon 8 Elite chipset, advanced camera features, and robust biometric security, the HONOR Magic 7 series is poised to make a significant impact in the smartphone market. As we await its official launch, it’s clear that HONOR is committed to delivering a flagship experience that meets the demands of discerning consumers.

Via

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