Renowned Apple analyst Ming-Chi Kuo has revealed that the upcoming iPhone 17, slated for release in Fall 2025, will feature an Apple-designed Wi-Fi 7 chip. This move signifies a significant shift away from relying on third-party suppliers like Broadcom for critical components.
By transitioning to its own Wi-Fi chip, manufactured using TSMC’s 7nm process, Apple aims to reduce costs and increase profit margins. The company plans to gradually integrate its in-house Wi-Fi chips into nearly all of its products over the next three years.
In addition to the Wi-Fi chip, Apple is also developing its own 5G modem. This separate chip, built using a different TSMC process, is expected to debut in the next-generation iPhone SE. However, this initial 5G-enabled iPhone SE will still rely on a Broadcom Wi-Fi chip.
As Apple continues to push the boundaries of hardware innovation, these strategic moves underscore the company’s commitment to greater control over its supply chain and product development.
