MediaTek may be taking a new approach with its next flagship mobile chipset. According to a new rumor from China, the upcoming Dimensity 9600 series will consist of three variants instead of just one: the Dimensity 9600s, Dimensity 9600 Pro, and Dimensity 9600 Pro Max.
The Dimensity 9600s is said to be an upgraded version of last year’s Dimensity 9500 rather than an entirely new flagship chip. It will reportedly remain on TSMC’s 3nm process, offering only slight improvements over the Dimensity 9500.
Meanwhile, the flagship lineup will consist of the Dimensity 9600 Pro and Dimensity 9600 Pro Max. Both chips are rumored to be built on TSMC’s 2nm process, but they’re expected to feature different CPU configurations. Specific CPU details, however, have yet to be revealed.
The reported naming strategy is similar to Apple’s Pro and Pro Max branding and also aligns with recent rumors that Qualcomm will split its upcoming Snapdragon 8 Elite Gen 6 lineup into multiple variants.
Performance-wise, the report claims the Dimensity 9600s won’t compete directly with Qualcomm’s upcoming Snapdragon 8 Elite Gen 6 due to its older 3nm manufacturing process. Instead, the Dimensity 9600 Pro is expected to rival the Snapdragon 8 Elite Gen 6, while the Dimensity 9600 Pro Max could go up against the rumored Snapdragon 8 Elite Gen 6 Pro.
If the leak is accurate, the new Dimensity 9600 lineup is expected to debut in September, with the vivo X500 series and OPPO Find X10 lineup tipped to be among the first smartphones powered by the new chips.
As always, this information is based on leaks and rumors. MediaTek has yet to officially announce the Dimensity 9600 series, so the names, specifications, performance, and launch timeline should be treated as unconfirmed until the company makes an official announcement.