Samsung is back in the race for next-generation chipmaking. After focusing on improving its 2nm technology, the company has reportedly restarted development of its 1.4nm process (SF 1.4), with mass production now planned for 2029 instead of the original 2027 target.
Right now, TSMC and Intel are leading the 1.4nm race. TSMC calls its process A14, while Intel uses the name Intel 14A, even though both belong to the 1.4nm class.
To speed up development, Samsung has reportedly asked equipment partners Applied Materials and Lam Research to begin early work on tools for the SF 1.4 process. The first machines will be sent to NRD-K, Samsung’s advanced semiconductor R&D center.
Samsung delayed its 1.4nm roadmap to focus on its SF2 and SF2P 2nm processes. That decision appears to have paid off, as the company reportedly achieved high 2nm production yields and secured orders to manufacture Tesla’s next-generation AI chips. With those milestones completed, Samsung is now moving forward with its 1.4nm plans.
The company has also received ASML’s next-generation High-NA EUV lithography system, which will be installed at NRD-K and used on selected manufacturing layers starting with the 1.4nm process.
Beyond logic chips, Samsung has also started ordering equipment for its V12 NAND memory, which is expected to enter full-scale mass production around 2030.
Samsung still trails its rivals in the 1.4nm race. Intel aims to begin mass production in 2027, while TSMC is targeting 2028. That puts Samsung about one to two years behind.
However, Samsung may have one advantage. Unlike TSMC, which has not yet adopted High-NA EUV tools for its 1.4nm roadmap, Samsung is already preparing to use the next-generation lithography technology for its future manufacturing process.