SD 8 Gen 3 chips to be manufactured mostly by TSMC

Qualcomm naturally is also jumping on the 3nm wagon to keep up with modern standards since Apple get first dibs into their A17 Bionic

The manufacturing of the Snapdragon 8 Gen 3 is anticipated to be outsourced by Qualcomm to long-standing partners TSMC and Samsung. However, according to the most recent information, due to the extraordinarily high yield rate of 80%, the Taiwanese manufacturer may end up receiving the majority of chip orders for the 3 nm process.

TSMC is able to implement between 75 and 80% of a single 3nm GAA wafer, compared to the industry average of 60 to 70%. If we can believe this information, Apple and Qualcomm’s A17 Bionic and Snapdragon 8 Gen 3 next-generation chipsets won’t experience any shipping problems. Prior to collaborating with the US company Silicon Frontline Technology, Samsung initially had a terrible yield rate of around 20%.

The problem for Qualcomm and other chip makers is that price is paid per wafer, and yielding fewer chips results in a higher price for a chipset for the end user, the smartphone manufacturer, which would result in a higher market price. This price increase would ultimately be detrimental to everyone.

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