Fresh leaks suggest Qualcomm is gearing up to unveil its latest flagship chipset, the Snapdragon 8 Gen 4, this October. While the official announcement is still months away, leaked details have already painted a promising picture of what to expect.
The chipset will come in two variants: the standard SM8750 and the overclocked SM8750P. Built on a cutting-edge 3nm process, both versions promise significant leaps in performance and energy efficiency.
At the core of the Snapdragon 8 Gen 4 is Qualcomm’s new Oryon CPU, designed for high-performance computing. Complementing this is the Adreno 8-series GPU, optimized for delivering top-tier graphics experiences. To harness the full potential of the chipset, Qualcomm has included support for dual-channel LPDDR5X RAM.
Photography and videography enthusiasts will be pleased with the Qualcomm Spectra ISP 8-series, expected to elevate mobile image quality to new heights. The chipset also includes dedicated hardware for video processing and high-definition display support.
Connectivity is another key focus. The Snapdragon 8 Gen 4 boasts a 5G modem with support for both mmWave and sub-6GHz bands, as well as Qualcomm’s FastConnect 7900 system for Wi-Fi 7, Bluetooth 5.4, and UWB connectivity.
Beyond raw power, the chipset emphasizes AI and security. A dedicated Low-Power AI (LPAI) subsystem ensures AI tasks can be handled efficiently without draining the battery. Additionally, the Qualcomm Aqstic WCD3955 audio codec promises high-quality audio, and a Secure Processing Unit is included for enhanced data protection.
While the SM8750 is expected to power most flagship phones launching in China from October to December, the Galaxy S25 Ultra is rumored to feature the SM8750P. Other flagship phones in China might adopt the SM8750P around mid-2025.