Sony and TSMC are teaming up to manufacture next-generation smartphone image sensors, combining Sony’s imaging expertise with TSMC’s advanced chip manufacturing technology.
Sony Semiconductor Solutions, Sony’s chip-making arm, will establish a joint venture with Taiwan Semiconductor Manufacturing Company (TSMC). Sony will remain the sole controlling shareholder of the new company.
The joint venture is targeting volume production in 2029, although it still needs to complete several regulatory and financial procedures.
Sony Semiconductor Solutions will contribute 465 billion yen, or around US$2.92 billion (€2.6 billion), through cash and assets.
TSMC will contribute 282 billion yen, equivalent to around US$1.77 billion (€1.5 billion).
Despite TSMC’s investment, Sony will maintain control of the joint venture.
The two companies will have different roles.
Sony will lead:
- Core image sensor technology development
- Product planning
- Product design
TSMC will provide:
- Advanced semiconductor process technology
- Manufacturing expertise
The partnership effectively combines Sony’s experience in camera and image sensor technology with TSMC’s advanced semiconductor manufacturing capabilities.
The joint venture aims to begin volume production in 2029.
However, the companies still need to complete the required regulatory and financial steps before the venture can fully move forward.
Sony and TSMC have not yet revealed which specific smartphone image sensors will be produced through the new venture.