TSMC’s 2-nm process node has major upgrades and may begin mass production next year.
During the IEEE International Electron Device Meeting in San Francisco, semiconductor firm TSMC featured the 2-nm “nanosheets” and its impact on the performance and power efficiency of new chipsets.
Moving from 3-nm to 2-nm has its challenges, shown by the latest flagship Snapdragon 8 Elite manufactured in 3-nm process like its predecessor. MediaTek just adopted 3-nm with its Dimensity 9400.
But before 3-nm chipsets could dominate every market, TSMC made breakthroughs that yielded techniques to enable mass production of 2-nm CPUs. On paper, TSMC’s high-end 2-nm processors will sport:
- 15% higher performance
- Up to 30% less power consumption
- 1.15 times more transistor density
The higher transistor density is the result of the all-around gate (GAA) nanosheet and the N2 NanoFlex, letting manufacturers put more logic cells – optimizing the node’s performance.
Also, manufacturers can optimize the parameters for various use cases. TSMC’s move from FinFet tech to N2 nanosheet enabled more precise control on the flow of the current.
So, how much will a 2-nm chipset cost? The N2 wafer’s price is estimated to be between $25,000 and $30,000 per piece depending on TSMC’s adjustments. That’s costlier than the 3-nm’s $20,000 per piece.
But if these upgrades are true, tech giants like Apple and Nvidia are expected to adopt the process node for their upcoming products. Mass production using 2-nm may begin in the second half of 2025.