Fresh details surrounding Xiaomi’s next in-house processor have surfaced, pointing to a major redesign for the company’s upcoming chipset. According to a new report, Xiaomi’s next silicon may be called the XRING O3, bringing a revised CPU layout, faster clock speeds, and possible deployment inside the rumored Xiaomi 17 Fold.
The information comes from Ximitime, which reportedly uncovered the details by examining Xiaomi’s Mi Code database. The same source previously revealed early information about the Xiaomi 17 Fold, adding weight to the latest leak.
Based on the report, the XRING O3 is being developed under the codename “lhasa.” The chip is also said to be intended for the Xiaomi 17 Fold, a device internally referred to as Q18, which has already appeared in IMEI database listings.
Compared to the earlier XRING O1, Xiaomi may be taking a simpler but more focused approach with the new processor. The previous XRING O1 reportedly used a four-cluster, 10-core architecture, while the XRING O3 is tipped to move to a three-cluster, octa-core design.
The new setup is said to consist of Prime, Titanium, and Little cores. While the final arrangement remains unclear, possible configurations mentioned include 1+3+4 or 1+2+5.
Performance appears to be getting a notable boost. The Prime core could surpass the 4GHz barrier, reportedly reaching up to 4.05GHz. Meanwhile, the Titanium cores, designed for demanding workloads, may run at 3.42GHz.
Perhaps the most surprising upgrade is in the efficiency-focused Little cores. These are reportedly clocked at 3.02GHz, a major leap over the 1.79GHz speed seen on the XRING O1. That increase could significantly improve background tasks and smoother app switching.
On the graphics side, the GPU is expected to run at nearly 1.5GHz, up from around 1.2GHz on the previous generation. Memory speeds, however, may remain unchanged at 9600 MT/s.
The report suggests these changes could be especially useful for foldable devices such as the Xiaomi 17 Fold, where multitasking and running multiple apps simultaneously are key use cases on larger displays.
While Xiaomi has yet to officially confirm the XRING O3, the leak hints that the company’s next custom chip may prioritize smarter efficiency, stronger sustained performance, and a design better suited for next-generation foldables.