Xiaomi‘s next-generation Xring O3 is already flexing its performance before launch. New Geekbench listings show the chip scoring more than 14,000 points in multi-core tests, giving Xiaomi’s upcoming flagship silicon a strong early showing.
The Xring O3 is expected to power the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max, with the latter reportedly appearing on Geekbench under the model number M367FC.
Over 14,000 points in multi-core
The latest benchmark entries show scores of:
- 14,319 multi-core
- 14,153 multi-core
- 3,474 to 3,710 single-core
The chip uses a 10-core CPU, consisting of four cores at 3.15GHz, four at 3.69GHz, and two high-performance cores reaching 4.36GHz. Graphics are handled by a 16-core Mali-G2-Ultra-NX GPU.
Xiaomi is also claiming up to 60% higher CPU performance, 85% higher GPU performance, and 64% better GPU power efficiency.
3nm chip with LPDDR6
The Xring O3 is built on a 3nm process, unlike upcoming flagship chips from Qualcomm and MediaTek that are expected to move to 2nm.
However, Xiaomi is reportedly making up for that with another first: LPDDR6 memory support.
The Xiaomi 18 Fold and Pad 9 Pro Max are expected to use 16GB CXMT LPDDR6 memory, offering speeds of up to 12,800Mbps and memory bandwidth of up to 113.8GB/s.
Xiaomi is also going big on AI
The Xring O3 reportedly delivers:
- 200 TOPS of tensor AI performance
- 3.13 TFLOPS of vector AI performance
- Up to 45% higher NPU performance
Xiaomi has also claimed an AnTuTu score of 5.22 million, which could make the Xring O3 the first mobile chip to cross the five-million-point mark.
These are still early benchmark results, and final performance will depend on the actual devices. But with a 10-core CPU, a 14K+ Geekbench multi-core score, LPDDR6 support, and ambitious GPU and AI claims, the Xring O3 is making one thing clear: Xiaomi’s custom-chip project is no longer playing around.