Xiaomi‘s new Xring O3 is already turning heads in early benchmark tests, with its 10-core CPU reportedly scoring 15,086 in Geekbench multi-core. The result puts Xiaomi’s custom chip well ahead of several Snapdragon 8 Elite Gen 5 results.
Strong CPU gains
Tests by Chinese outlet Xiaobai’s Tech Reviews, using what appears to be a reference device, recorded 3,854 in single-core and 15,086 in multi-core.
The single-core score is roughly comparable to the Snapdragon 8 Elite Gen 5 and Apple’s A19 Pro, while also representing a 25% improvement over the Xring O1.
The multi-core result is even more impressive, with around a 55% increase over the Xring O1 and a score above 12,000-point results reported for devices using the Snapdragon 8 Elite Gen 5.
The Xring O3 reportedly scored more than 40% higher than current flagship chipsets in 3DMark Steel Nomad Light.
Compared with the Xring O1, the improvement reportedly reaches up to 90%. The chip also showed better performance per watt, suggesting Xiaomi has focused heavily on efficiency.
Interestingly, the Xring O3 uses TSMC’s N3P process, rather than the newer N2 process expected for upcoming flagship chips from Qualcomm, Apple, and MediaTek.
Despite that, these early results suggest Xiaomi’s chip could compete with the next generation of flagship silicon.
Xiaomi has confirmed the Xring O3 will power devices including the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max.
There’s an important caveat: these tests were performed on a prototype or reference platform, not a final retail device.
Actual performance will depend on cooling, sustained power limits, and software optimization. The GPU benchmark results also need more context before they can be directly compared with other chips.
Still, the early numbers are promising. Xiaomi’s Xring O3 could turn its custom-chip project into a serious flagship competitor.