Red Magic 9 Pro is arriving on November 23 with a captivating new look and powerful processor.
A new powerful gaming smartphone is coming this month sporting a fresh design for gamers, tech enthusiasts, and casual users.
It’s the Red Magic 9 Pro, powered by Qualcomm Snapdragon 8 Gen 3, which has zero camera bumps, tri-color lights, and incredible thinness. Of course, the smartphone includes a cooling vent powered by a fan to take away the heat.
The Red Magic 9 Pro initially went live on Weibo where it was shown with flat front and back sides; very ergonomic for mobile gaming. The same photo also showed the cooling vent on the side.
Now, the smartphone’s rear profile has been showcased. Not only that it has a powerful chipset, but it also boasts three cameras at the back. Its body is even claimed to be only 8.9mm thin!
A report suggested that all three cameras are 50MP and can be triggered using a dedicated red button below the circular power key. Though, we don’t know if this red button is customizable for other functions.
The back panel highlights the Snapdragon 8 Gen 3 and the cooling system. On top of it is the “09 GENERATION” indicating the series.
Like other gaming smartphones, Red Magic 9 Pro has RGB lights at the back located below the cameras. But the lights aren’t just blinking when you interact with the phone or vice versa.
The lights move in a circular manner, and if your curiosity gets the best of you, you can also look at them from the cooling vent.
Another plus point for this upcoming smartphone is the lack of a waterdrop notch or punch hole. The selfie camera is under the display just like its predecessor for total visual immersion.
Red Magic 9 Pro appeared on Geekbench with a CPU configuration of 1 x 3.19GHz, 5 x 2.96GHz, and 2 x 2.27GHz, and 12GB RAM and Android 14. It scored 2,173 in single-core and 6,704 in multi-core.
Red Magic 9 Pro is scheduled for an official unveil on November 23. The global release and pricing are not yet confirmed as of writing. The phone comes in three colorways.
