MediaTek’s latest mid-range offering, the Dimensity 6300 chipset, arrives as the successor to the well-received Dimensity 6100+.
This new chip boasts a significant performance boost with its main Cortex-A76 cores overclocked to 2.4 GHz (up from 2.2 GHz). It also features a Mali-G57 MC2 GPU, promising over 50% improvement in graphics processing compared to its predecessor.
Built on TSMC’s power-efficient 6nm process, the Dimensity 6300 prioritizes battery life with MediaTek’s UltraSave 3.0+ technology. The integrated 5G modem supports the latest 3GPP Release 16 standard, ensuring future-proof connectivity.
While maintaining compatibility with LPDDR4x RAM and UFS 2.2 storage, the Dimensity 6300 can now drive displays with up to 1080 x 2520 resolution. Camera enthusiasts will appreciate support for high-resolution sensors up to 108MP. Connectivity options include dual-band Wi-Fi 5 and Bluetooth 5.2.
The realme C65 5G is expected to be the first smartphone to leverage the power of the Dimensity 6300, launching later this month.
