MediaTek debuts RedCap modem technology and chipset family, and introduces the second-generation Filogic chipsets to deliver Wi-Fi 7 speeds, peak performance, and always-on reliability.
MediaTek RedCap Solutions
Leveraging its industry expertise in 5G connectivity, MediaTek announced it is expanding its family of modems and chipsets to support 5G RedCap. The M60 modem IP and MediaTek T300 chipset series will make it easy for MediaTek to facilitate the transition to 5G-NR for a wide range of applications that require long lasting and efficient battery life, such as wearables, light-weight AR devices, IoT modules, and devices built with edge AI in mind.
RedCap or “reduced capability” is designed to bring the benefits of 5G to NR consumer, enterprise, and industrial devices. Taking full advantage of the evolution of 5G networks to the Standalone (SA) network architecture, RedCap promises to deliver reliability for devices with low bandwidth requirements, offering several benefits of 5G without the cost and complexity of typical 5G solutions.
“Our RedCap solutions are a significant part of our mission to democratize 5G, providing our customers the ability to optimize components and deliver 5G-enabled devices from a range of applications and a range of price points,” said JC Hsu, Corporate Senior Vice President at MediaTek.
Built on the highly efficient TSMC 6nm process, the MediaTek T300 series integrates a single-core Arm Cortex-A35 in a significantly more compact PCB area. The MediaTek T300 series supports up to 227 Mbps downlink and 122 Mbps uplink data rates.
By leveraging MediaTek’s UltraSave 4.0 technology and reducing unnecessary paging receptions, the M60 offers up to a 70% reduction in power consumption compared to similar 5G eMBB solutions and up to 75% power savings compared to 4G LTE solutions.
To learn more about MediaTek’s RedCap initiatives, please visit: https://www.mediatek.com/technology/5g/5g-redcap-modem.
MediaTek Wi-Fi 7 Solutions
MediaTek, one of the first adopters of Wi-Fi 7 technology, now has the industry’s most comprehensive Wi-Fi 7 portfolio with the new Filogic 860 and Filogic 360 solutions. Together, these second-generation additions aim to further expand MediaTek’s platform of cutting-edge products that utilize the latest technology advancements in connectivity while achieving peak performance and always-on reliability.
Filogic 860 combines a Wi-Fi 7 dual-band access point with a new advanced network processor solution and is ideal for enterprise access points, service provider Ethernet gateways and mesh nodes, as well as retail and IoT router applications. Filogic 360 is a standalone client solution that integrates Wi-Fi 7 2×2 and dual Bluetooth 5.4 radios in a single chip, and is designed to deliver next-generation Wi-Fi 7 connectivity to edge devices, streaming devices and a vast array of other consumer electronics.
“Filogic 860 and Filogic 360 offers the same technology as our premium solutions with exceptional reliability in busy network environments, ultra-fast speeds with reduced latency and enhanced range,” said Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity Business at MediaTek.
The Filogic 860 platform includes with the following features:
- Industry leading 6nm low power Wi-Fi design
- Single-MAC MLO support
- Supports 4096-QAM and MRU
- Supports dual-band Wi-Fi 7 with industry-highest dual-band MLO speed, 7.2Gbps
- Dual-band, dual concurrent capabilities with 4T4R for 2.4GHz up to BW40 and 5T5R 4SS for 5GHz up to BW160
- Support for an additional receive antenna for zero-wait DFS
- Filogic Xtra range support, boosting receiving distance using an extra antenna
Key features of the Filogic 360 include:
- Triple-band selectable Wi-Fi 7 2×2 with up to 2.9Gbps speed
- Supports 4096-QAM and MRU
- 160MHz channel bandwidth support
- Filogic Xtra range support, boosting communication distance by unique Hybrid MLO solution
- Support for dual Bluetooth 5.4 cores for gaming and other applications
- BLE audio with integrated DSP for LC3 codec support
- MediaTek advanced Wi-Fi and Bluetooth coexistence technology ensures both technologies can operate on the 2.4 GHz band seamlessly, without interference
The MediaTek Filogic 860 and Filogic 360 solutions have begun sampling to customers and mass production is anticipated for mid-2024.
To learn more about MediaTek’s Filogic portfolio, please visit: https://www.mediatek.com/products/networking-and-connectivity/filogic-wifi6-wifi7.
