The highly anticipated HUAWEI P70 series is poised to feature an innovative new chipset, tentatively identified as the “Kirin 9010,” as disclosed by Smart Pikachu on Weibo. While the official announcement of the chip is pending, it has been in development for an extended period.
The initial mention of the Kirin 9010 surfaced three years ago when a leakster unveiled it as a cutting-edge 3nm chip. Originally expected to be produced by TSMC, recent trade restrictions on Huawei have cast doubt on this likelihood.
In a recent revelation, HUAWEI was found to be dispatching laptops equipped with Kirin 9006C chips manufactured by TSMC. However, it was clarified that this inventory consisted of older stock. Meanwhile, SMIC, working on 7nm chips akin to the Kirin 9000 series, lags behind TSMC’s superior 5nm node performance. Although SMIC may be developing a 3nm node, it is likely years away from fruition.
The uncertainty looms over whether the Kirin 9010 will indeed be a 3nm chip or if Huawei is simply repurposing the nomenclature. This ambiguity may persist unless HUAWEI has devised a solution to navigate the trade restrictions, considering the company had officially trademarked the name in 2021 with initial plans for production in 2022, which ultimately faced setbacks.
Reports suggest that the P70 series will mark the return of 5G connectivity for HUAWEI. Notably, rumors abound regarding the P70 Art’s ultra-wide camera, rumored to boast a 1-inch type sensor paired with a high-quality 1G6P lens featuring one glass element and six plastic elements. Huawei is reportedly working on developing its own sensors, anticipated to debut with the P70 series slated for unveiling in March.
