MediaTek is set to announce its Dimensity 8300 midrange chipset next week, but we now have a Geekbench run for the Redmi K70 which is expected to be amongst the first phones on the market with the new SoC.
The Redmi K70 (Xiaomi 2311DRK48C) scored 1,512 single-core points and 4,886 multi-core points on Geekbench, which is slightly higher than the outgoing Dimensity 8200 and 8200 Ultra. This suggests that the Dimensity 8300 will be a significant performance upgrade over its predecessor. The listing also reveals that the K70 will come with 16GB of RAM and boot Android 14 with Xiaomi’s HyperOS out of the box.
Dimensity 8300 Expected Features
The Geekbench listing also reveals some of the expected features of the Dimensity 8300. The chip is expected to feature a 1+3+4 architecture with ARMv8-based cores. There will be one Cortex-A715 performance core clocked at 3.35GHz, three Cortex-A715 cores at 3.32GHz, and four Cortex-A510 efficiency units at 2.2GHz. On the GPU side, there will be the Mali-G615 MC6 GPU.
Redmi K70 Release Date
The Redmi K70 is expected to launch soon, but there is still no official word from Xiaomi. We are also expecting a K70 Pro model with the Snapdragon 8 Gen 3 chip.
The Redmi K70 looks like a promising midrange phone with a powerful chipset and plenty of RAM. We are excited to see how it performs in real-world tests.
