Last year, Apple made waves with the announcement of its highly anticipated M3 chips, engineered on TSMC’s cutting-edge 3nm architecture. The M3 Pro and M3 chips showcased significant performance improvements over their predecessors, the M2 chips.
Well, according to a report, Apple is already in the early stages of developing its next-generation Apple Silicon. Apple is poised to become TSMC’s primary client for their groundbreaking 2nm chips, heralding a new era of computational and graphical prowess for iPhones and Macs.
Further details on TSMC’s 2nm chips are expected to emerge soon, with mass production anticipated to commence in the latter half of 2025. Until then, products launched within this timeframe will likely incorporate TSMC’s 3nm architecture.
For those unacquainted with the technology, a lower nanometer count signifies a smaller transistor size, allowing more transistors to be accommodated within the processor. TSMC’s 2nm chips promise not only heightened performance but also improved energy efficiency. This translates into the prospect of extended battery life for future Apple devices, such as iPhones and MacBooks.
TSMC’s advancements continue with the transition to 2nm chips, involving the adoption of GAAFET (gate-all-around field-effect transistors) with nanosheets, a departure from FinFET. Despite a more intricate production process, this innovation allows for smaller transistor sizes and lower power consumption.
Anticipated in 2025, Apple’s adoption of the 2nm architecture is expected to coincide with the launch of the iPhone 17 lineup and extend to the M-series of chips. TSMC is also discreetly working on its 1.4nm architecture, slated for announcement in 2027. In a trend likely to persist, Apple is expected to be among the first recipients of the 1.4nm chips from TSMC.
