TSMC’s 3nm chips are scheduled for production next year and will debut in MediaTek’s Dimensity series.
MediaTek and TSMC officially unveils their latest success in the flagship chipset race – TSMC’s 3nm technology. This breakthrough will launch on MediaTek’s flagship Dimensity SoC and is expected to begin production by 2024.
“We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. “TSMC’s consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”
“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“
TSMC’s 3nm tech will have better performance, power, and yield overall, on top of its complete platform support for high-performance computing and mobile apps. Unlike the 5nm process, the latest tech can reach up to 18% higher speed for the same power or 32% power reduction for the same speed. Plus, it has about 60% increased in logic density. These enhancements suggest lower power consumption and heat while maintaining high performance.
MediaTek’s first 3nm Dimensity SoC is planned for smartphones, tablets, intelligent cars, and more in the second half of 2024.
